Single Layer Flexible PCB Production Record #FPC-20260622-059

This production record covers 15 single-layer flexible PCBs built on 0.11 mm polyimide material with 1 oz rolled copper. The boards measure 161.54 × 233.93 mm and required careful substrate handling to preserve inherent flexibility at this thin profile. Standard 6/6 mil trace spacing, 0.3 mm minimum holes, yellow soldermask, white silkscreen, and OSP surface finish defined the stackup, with no stiffeners specified to maintain full dynamic capability.

Manufacturing followed the sequence of polyimide material preparation, circuit imaging and etching, coverlay lamination, solder mask application, and organic coating with anti-oxidation treatment. Dynamic flex testing was performed on every board to confirm endurance under repeated bending, complemented by full electrical testing. The rolled copper choice supported consistent etch uniformity and long-term flex reliability throughout the process.

Completed in 7.7 days, the order delivered uniform mechanical and electrical performance across the full batch. Particular attention to thin-material registration and surface preparation ensured the finished flexible circuits met all dimensional and functional criteria without compromise.