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How to Use a Wetting Balance for SMT Solderability Testing

Author : Daniel Li | PCB Assembly & Electronics Application Engineer

October 13, 2026


A wetting balance is a precision test instrument used to measure force or mass changes during solderability testing. It plays an important role in evaluating how effectively a component lead, PCB pad, or other test specimen is wetted by molten solder. Correct operation is essential for obtaining reliable results and protecting the instrument from damage.

Wetting balance used for SMT solderability testing

 

Basic Structure of a Wetting Balance

Before operating the instrument, it is useful to understand its basic structure. A conventional balance generally consists of a base, beam, pans, rider, balance adjustment nuts, graduated scale, weights, and associated electronic display and control components.

The pan supports the specimen or weights during measurement. The rider is used for fine adjustment of the balance. The adjustment nuts are used during initial leveling to bring the beam into a balanced position. The graduated scale and electronic display provide the measurement result.

In a solderability testing system, the balance is integrated with additional components used to control the test environment. Depending on the instrument configuration, these components may include a temperature controller, heater, heating furnace, solder pot, temperature-sensing wire, LCD display, and operating buttons.

 

Operating Procedure

1. Preparation

  1. Position the balance horizontally. Place the wetting balance on a stable, level workbench. Avoid locations subject to vibration, impact, or tilting, because mechanical disturbance can affect the measurement.
  2. Return the rider to zero. Gently move the rider to the zero position on the graduated scale before beginning the measurement.
  3. Adjust the balance. Turn the balance adjustment nuts at both ends until the beam reaches a stable horizontal position and the pointer aligns with the center graduation. Several adjustments may be required before the balance remains steady.

2. Weighing Procedure

  1. Place the specimen on the left pan and the weights on the right pan. Follow the conventional "object on the left, weights on the right" arrangement. Handle the specimen carefully and lower it gently to avoid shock loading the balance.
  2. Add the weights progressively. Begin with a weight close to the estimated maximum mass, then reduce the weight step by step until the beam approaches equilibrium. Use tweezers to handle the weights rather than touching them directly with bare fingers. This helps reduce contamination and measurement error.
  3. Move the rider for fine adjustment. If the balance does not reach equilibrium after the weights have been positioned, move the rider to make a fine adjustment. The rider should be moved slowly and smoothly rather than abruptly.
  4. Read the result. Once the balance is stable, keep the line of sight level with the concave surface of the liquid level or the relevant reading position. Record the combined value of the weights and rider. A typical pan balance reading is generally accurate to 0.1 g.

3. Special Functions of a Wetting Balance

Some wetting balances, such as the SAT-5100, include functions for more complex solderability testing. These functions may include temperature control, a heating furnace, and a solder pot.

Temperature Control

Set the required test temperature using the temperature controller, then activate the heater switch. During heating, monitor the temperature through the temperature-sensing wire or the instrument display. The test should not begin until the solder and the relevant test area have reached the required temperature condition.

Heating Furnace and Solder Pot

Place the test specimen in the heating furnace and use the furnace's positioning and fixing mechanisms to control its location and height. The solder in the solder pot is then heated until it reaches a molten state for the solderability test.

The specimen must be positioned consistently relative to the molten solder. Its position and immersion condition directly affect the measured wetting behavior, so the positioning mechanism should be adjusted carefully before the test begins.

Operating Interface

The SAT-5100 wetting balance includes an LCD and operating controls such as a SELECT knob and a NEXT/ENTER confirmation key. These controls can be used to set test parameters, confirm selections, and view test results.

 

Calibration and Routine Maintenance

Regular calibration is necessary to maintain measurement accuracy. Use standard weights and follow the instrument manufacturer's calibration procedure. Calibration should be performed at the required intervals and whenever the balance has been moved, subjected to impact, or shown unstable readings.

Keep the balance clean and dry. Prevent exposure to moisture and corrosive gases. After use, remove residue from the pans, rider, and other accessible parts. Store the weights and accessories in their designated locations to prevent loss, contamination, or mechanical damage.

 

Important Operating Precautions

1. Allow the Specimen to Reach Room Temperature

Objects that are excessively cold or hot should not be placed directly on the balance. Allow them to reach room temperature in a desiccator before weighing, or weigh them in a suitable container when the procedure requires it. Temperature differences can influence the measurement and may also produce unstable readings.

2. Check the Condition of the Weights

Weights must remain clean and dry and should be stored in their weight box. Replace weights that have become rusty or significantly worn. Rust changes the effective mass and may cause the measured value to be lower than expected, while wear reduces the actual mass and may cause the indicated result to be higher than expected.

3. Handle Weights Correctly

Use tweezers to pick up and place the weights. Avoid direct contact with bare hands, which can transfer oils, moisture, or contaminants to the weight surfaces. After removal, return each weight directly to its box rather than leaving it on the workbench.

4. Select an Appropriate Weighing Method

The weighing method should match the physical properties of the material. For dry solid materials, place sheets of equal mass on the two pans and put the material on the sheet for weighing. For materials that readily absorb moisture, use a glass container such as a small beaker or watch glass.

When a container or sheet is used, determine its mass in advance and subtract it from the combined measurement. This tare value must be recorded accurately so that the mass of the test material is not overstated.

5. Follow Controlled Operating Practices

Operate the balance gently and avoid rough handling. Add or remove weights slowly, move the rider smoothly, and wait for the beam or display to stabilize before recording a result. Keep the viewing angle level with the relevant reading surface to reduce parallax error.

After weighing is complete, return the rider to zero and remove the weights from the pan. Leaving the balance loaded or the rider away from zero can complicate the next measurement and may place unnecessary stress on the mechanism.

6. Observe Thermal and Electrical Safety

During solderability testing, the heating furnace and solder pot may reach high temperatures. Do not touch these components directly during or immediately after operation. Keep combustible and explosive materials away from the instrument and its heated parts.

Allow hot components to cool in a controlled manner before cleaning or repositioning them. The work area should remain clear so that the operator can safely access the controls without contacting the molten solder or heated surfaces.

 

Wetting Balance Maintenance and Storage

  • Clean the balance: Regularly clean the pans, rider, graduated scale, and other accessible components with a soft cloth or suitable brush. Remove residue that could interfere with movement or measurement.
  • Inspect the components: Check whether any parts are loose, damaged, contaminated, or showing abnormal wear. Repair or replace defective parts promptly.
  • Calibrate the instrument: Use standard weights and follow the specified calibration instructions to verify measurement accuracy.
  • Control the storage environment: Store the balance in a dry, well-ventilated area free from corrosive gases. Avoid excessive humidity and high temperatures, which can affect both mechanical and electronic components.

For systems that include a solder pot and heating furnace, maintenance should also include inspection of the temperature-sensing connection, positioning mechanism, fixing mechanism, control buttons, and display. Any solder residue should be removed only after the relevant parts have cooled and in accordance with the equipment operating procedure.

 

Conclusion

A wetting balance is an important instrument for SMT solderability testing and related mass or wetting measurements. Accurate results depend on proper leveling, correct use of weights and the rider, stable reading conditions, and consistent specimen positioning. When the instrument includes temperature control, a heating furnace, and a solder pot, the operator must also control the test temperature and observe the required thermal safety precautions.

Regular calibration, careful handling, proper cleaning, and suitable storage help maintain measurement accuracy and extend the service life of the equipment. Following a controlled operating procedure ensures that the balance can provide repeatable and reliable results for solderability evaluation, laboratory testing, and production-related quality control.

Daniel Li | PCB Assembly & Electronics Application Engineer Daniel Li | PCB Assembly & Electronics Application Engineer

Daniel Li is an experienced PCB assembly and application engineer with over 10 years of experience in SMT and DIP processes. He focuses on soldering quality, stencil design, and defect analysis, as well as real-world PCB applications across industries such as automotive, industrial, and consumer electronics. At AIVON, he reviews and improves content related to assembly techniques and application scenarios, helping bridge the gap between design and manufacturing.

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