The order parameters record a flexible circuit with dimensions of 86 × 112 mm and a layer count of 6. Board thickness is listed as 0.23 mm. Material is given as rolled copper. Copper thickness appears as ½ oz Cu / ½ oz Cu. Solder-mask color is shown as yellow on the top side and yellow on the bottom side. Silkscreen color is shown as white on the top side and white on the bottom side. Surface treatment is listed as ENIG with a value of 1.00. Hole diameter is recorded as 0.15. Trace width and spacing are recorded as 4 mil. Forming method is listed as laser forming. Quantity is 20 pieces. Delivery type is single piece. Via treatment is listed as via-cover oil. No reinforcement category or thickness is entered. Impedance is marked no. Flying-probe testing is indicated. The order also contains entries for process edge of 0 mm, V-cut spacing of 0.00×0.00, panel count of 1, and panelization of 1×1.
The engineering communication attached to the order states that the thickness of the six-layer board cannot be made to 0.23 mm. It further states that a suggested stack-up from the factory is attached and asks the customer to confirm whether the suggested stack-up meets the requirements. It also states that the factory production draft is attached and asks the customer to confirm whether the production draft is acceptable.
6-Layer FPC Thickness Limitation at 0.23 mm
The order ( #FPC-20241111-0056 ) parameters list the board thickness as 0.23 mm for the 6-layer construction. Copper weights are entered as ½ oz for the inner layers and ½ oz for the outer layers. Coverlay color is entered as yellow on both sides. The forming method is entered as laser forming. These values appear together in the order data. The engineering communication refers to the six-layer board and to the thickness of 0.23 mm when it states that this thickness cannot be made.
The communication does not list any other thickness number in its text. It identifies the 0.23 mm figure that appears in the order and states that the thickness cannot be achieved for the six-layer board. The copper weights, coverlay color, silkscreen color, ENIG finish, hole diameter, and laser-forming method remain as entered in the order parameters and are not restated in the communication text.
Proposed 6-Layer FPC Stack-Up for Thickness Requirements
The communication states that a suggested stack-up from the factory is attached. It then asks the customer to confirm whether the suggested flexible PCB stack-up meets the requirements. The text of the communication does not include the layer sequence, individual layer thicknesses, or copper weights that may be shown in the attachment. It records only that the suggested stack-up is attached and that confirmation is requested on whether the stack-up meets the requirements.
The flexible PCB parameters continue to show the original thickness of 0.23 mm, the original copper weights of ½ oz / ½ oz, and the original coverlay and silkscreen colors. The communication presents the attached stack-up as the item offered in connection with the statement that 0.23 mm cannot be made, and it places the confirmation request directly after that statement.
FPC Production Draft Review and Customer Approval
The communication states that the factory production draft is attached. It then asks the customer to confirm whether the production draft is acceptable. The production draft is referenced in the same communication that contains the thickness statement and the suggested stack-up. The text does not describe individual features of the draft such as line widths, hole locations, or outline dimensions. It records that the draft is attached and that confirmation of its acceptability is requested.
The order parameters list a factory number, a creation time, a supplier name, and a production-confirmation flag. The communication adds the attachment of the production draft and the request for confirmation of that draft. Both the suggested stack-up and the production draft are therefore presented together with the statement concerning the 0.23 mm thickness.
suggested FPC stack-up
6-Layer Flexible PCB Specifications and Manufacturing Parameters
In addition to thickness and layer count, the flexible PCB parameters contain the following entries: size 86 × 112, quantity 20 pieces, copper ½ oz / ½ oz, yellow coverlay top and bottom, white silkscreen top and bottom, ENIG 1.00, hole diameter 0.15, trace and space 4 mil, laser forming, via-cover oil, no impedance, no reinforcement, single-piece delivery, and 1×1 panelization. These entries define the construction as submitted. The engineering communication addresses the thickness value among these entries by stating that 0.23 mm cannot be made for the six-layer board and by attaching a suggested stack-up for confirmation.
The communication does not restate the size, the quantity, the hole diameter, the trace and space, or the surface-finish value. It confines its text to the thickness statement, the attachment of the suggested stack-up, the request for confirmation of the stack-up, the attachment of the production draft, and the request for confirmation of the draft.
FPC Stack-Up and Production Draft Confirmation
Two confirmation requests are written in the communication. One request asks whether the suggested stack-up meets the requirements. The other request asks whether the production draft is acceptable. Both requests appear after the statement that the six-layer board thickness cannot be made to 0.23 mm. The order parameters show a production-confirmation entry marked yes. The communication contains the two requests for confirmation of the attached stack-up and the attached draft.
The suggested stack-up is identified as the factory's suggestion offered in connection with the 0.23 mm thickness. The production draft is identified as the factory's draft submitted for confirmation. Both are referenced as attachments within the single communication that records the thickness limitation for the six-layer board.
6-Layer FPC Manufacturing Review: Thickness, Stack-Up, and Draft
The order lists a 6-layer flexible circuit of 86 × 112 mm at 0.23 mm thickness, with rolled copper, ½ oz copper on inner and outer layers, yellow coverlay on both sides, white silkscreen on both sides, ENIG, 0.15 mm holes, 4 mil trace and space, and laser forming. The engineering communication states that the thickness of the six-layer board cannot be made to 0.23 mm. It states that a suggested stack-up is attached and asks for confirmation that the suggested stack-up meets the requirements. It states that the production draft is attached and asks for confirmation that the production draft is acceptable. These are the statements contained in the order parameters and the engineering communication.
